Source: Science and Technology News
Foreign media reported that Japanese materials manufacturer Denki Glass recently announced the launch of a new semiconductor substrate material GC Core (Glass-Ceramics, glass ceramics). Because glass substrates are stronger and have a smoother surface than organic substrates, making them easier to carry ultra-fine circuits, they are expected to become a star material in the field of advanced packaging. As a result, important semiconductor companies including Intel and Samsung are also developing in this direction.
Although the biggest advantage of glass substrates is that they support the construction of TGV (through glass via) vertical channels, the brittleness of the glass material itself limits its application in substrates to a certain extent. For example, the current use of common CO2 lasers to drill holes in glass substrates is prone to cracks, which may eventually lead to the substrate breaking. Therefore, if you want to avoid this problem, you need to use an etching process to make holes instead. Not only is this solution technically more cumbersome, it will also incur additional costs.
Therefore, the GC Core glass ceramic substrate material developed by Denki Glass this time is made of glass powder and ceramic powder co-fired at low temperature. It has some properties of ceramic. It is not easy to produce cracks and can be drilled directly using CO2 laser to reduce mass production costs. And, not only that, substrates using GC Core glass ceramic substrate materials have lower dielectric constants and polarization losses, which can reduce signal attenuation in ultra-fine circuits and improve circuit signal quality. Therefore, the substrate produced by Denki Glass GC Core glass ceramic substrate material is stronger than the traditional glass substrate and can further reduce the thickness of the substrate.
The report emphasized that the GC Core glass ceramic substrate material is made by adjusting the proportion of glass and ceramic powder. Electric Glass can customize the GC Core substrate according to the needs of semiconductor customers. Currently, its Three types of products can be produced: standard low dielectric constant type, high thermal expansion coefficient type and high mechanical strength type. In this regard, Electric Glass stated that the company has successfully produced 300x300mm square GC Core glass ceramic substrate materials.The goal is to expand the size to 510x510mm by the end of 2024.
Global display driver chip and power management chip analysis report
Chapter 1 Overview of the Semiconductor and Integrated Circuit Industry
1. Overview of semiconductors and integrated circuits
2. Introduction to the semiconductor and integrated circuit industry chain
1. Industrial chain classification
2. Overview of various industries
Chapter 2 Market Overview of the Integrated Circuit Design Industry
1. Overview of the development of the integrated circuit design industry
2. Market analysis of integrated circuit design industry
Chapter 3 Overview of Display Driver Chip Market
1. Introduction to the display driver chip industry
1. Introduction to display driver chip functions
2. Introduction to the display driver chip industry chain
3. Introduction to the cost structure of display driver chips
4. Introduction to the business model of the display driver chip industry
2. Overview of display driver chip market development
1. Overview of global and mainland China display driver chip market development
2. Analysis of the driving forces for the development of the display driver chip market
3. Analysis of market demand trends for display driver chips
1. Analysis of main application market trends of display driver chips
1.1 Global and Mainland China wearable market display driver chip market demand trends
1.2 Global and Mainland China mobile phone market display driver chip market demand trends
1.3 Global and mainland China personal computer market display driver chip market demand trends
1.4 Display driver chip market demand trends in global and mainland China TV and commercial display markets
1.5 Global and Mainland China automotive industrial control application market display driver chip market demand trends
2. Market Trend Analysis of Main Technology Types of Display Driver Chips
2.1 Global and Mainland China TFT-LCD driver chip market demand trend
2.2 Global and Mainland China TDDI driver chip market demand trends
2.3 Global and Mainland China AMOLED driver chip market demand trends
4. Competitiveness Analysis of Global Driver Chip Design Companies
1. Definition of core competitiveness in the driver chip design industry
2. Analysis of global display driver chip technology competitiveness
3. Analysis of the competitive landscape of display driver chip market in major application markets
3.1 Analysis of the competitive landscape of global and mainland China wearable display driver chip markets
3.2 Analysis of the competitive landscape of global and mainland China mobile phone display driver chip markets
3.3 Analysis of the competitive landscape of global and mainland China personal computer display driver chip markets
3.4 Global and Mainland China TV and Commercial Display Display Driver Chip Market Competitive Landscape Analysis
3.5 Global and Mainland China Vehicle Industrial Control Application Display Driver Chip Market Competitive Landscape Analysis
4. Analysis of the competitive landscape of the main chip types display driver chip market
4.1 Analysis of the competitive landscape of global and mainland China TFT-LCD driver chip markets
4.2 Global and ChinaAnalysis of the competitive landscape of China's TDDI driver chip market
4.3 Analysis of the competitive landscape of global and mainland China AMOLED driver chip markets
5. Analysis of the competitive landscape of local chip design companies in mainland China
Chapter 4 Analysis of Display Panel Power Management Chip Industry
1. Introduction to power management chips
1. Overview of power management chip
2. Introduction to display panel power management chip
2. Analysis of global and mainland China display panel power management chip market size
3. Analysis of the competitive landscape of the global display panel power management chip market
Contact us
Business cooperation:
Ms. Ceres
TEL: (+86) 137-7604-9049
Email: CeresMa@cinno.com.cn
CINNO PublicPublic Account Matrix
For more business cooperation, welcome to contact the editor!
Please note when scanning the QR code: name + company + position
I am the strongest editor of CINNO, and I am waiting for you!
CINNO was founded in Shanghai at the end of 2012. It is a domestic independent third-party professional industry consulting service platform dedicated to promoting the development of the domestic electronic information and technology industry. In the past twelve years since its establishment It is not limited to industrial information, market consulting, due diligence, project feasibility studies, management consulting, investment and financing, etc., covering the core interest demands of each stage of the enterprise's growth cycle, in details such as display, semiconductor, consumer electronics, intelligent manufacturing and key components. In different fields, we have accumulated hundreds of high-tech core high-quality corporate customers from mainland China, Taiwan, Japan, South Korea, Europe and the United States.
